The failure rates of most electronic components increase exponentially with a rising temperature. Vice versa, a temperature reduction of 10 °C leads to a doubling of lifetime. Knowing this correlation, we pushed the thermal design of our micro-inverter to the limits: every little feature is designed to reduce temperature inside the inverter and to facilitate the heat flow out of the device. With its characteristic linear shape and aluminum housing our inverter is designed for almost perfect heat dissipation.
By means of our unique high-frequency technology, we were able to miniaturize our inverter to a size that fits nicely into the frame of the PV module. Thanks to the inverter’s flat surface, the frame acts as a cooling fin.
When installing the inverter on the mounting structure, the thermal connection to the rail can support the product’s inherent cooling mechanism.